As we have already seen talking about thermal dissipation of enclosure, the first step to take for an effective and efficient climate management of the enclosure is the correct sizing of the system.
Sizing to perform the climate management of the enclosure
An undersized system can’t guarantee the desired conditions, of course. But even a precautionary, or oversized, project will never work at 100% of its nominal power, being inefficient and subjected to abnormal consumption, due to frequent on/off switching of the climate management system.
It’s therefore necessary to define an adequate regulation method that goes hand in hand with the choice and the sizing of the cooling system. Generally, the systems equipped with a cooling unit have also an electronic regulator which, in addition to controlling the temperature, performs the anticyclical delay function when the compressor is switched on. Instead, for systems cooled by fan filter unit, electromechanical devices represent the most widespread solution.
Temperature or humidity transients are generally slow and threshold-based ON / OFF control with hysteresis is almost always adequate, although with inevitable overshoot or undershoot effects, due to the differential width of traditional thermostats and hygrostats, factory-set.
Advances in industrial automation in the climate management of electrical panels
The industrial automation is experiencing an exponential increase in complexity, for on-board enclosures. The phenomenon is explained both by the integration needs of different disciplines within a single plant (automation, functional safety, interconnection), and the availability of new generations of controls (PLC or IPC) and actuators. The comparison with older on-board enclosures shows a huge generational leap that, as the complexity of the system increases, also grows the need for accuracy and customization of climate control.
Thermo-hygrostats have been on the market for years and, as laboratory comparative analyzes confirm, offer interesting improvements in performance in terms of measurement accuracy and speed of response, if compared to traditional devices. However, the mere migration from one technology to another makes no sense if we don’tt set ourselves the goal of obtaining the maximum benefits, extending the concept directly to the “mechatronics”, obtaining:
- simultaneous processing of signals from multiple sensors, both physical and virtual (based on the correlation of different measurements);
- programmable hysteresis according to the panel’s thermal load;
- simplification of wiring;
- supervision of the efficiency of the actuators and predictive maintenance;
- recording of measured data and events (alarms and peak values);
- fieldbus accessibility and interoperability;
The future of thermal management in enclosures is Sensis by Fandis
With Sensis by Fandis, the new smart device, you can do all of this. It’s the future of thermal management.
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